| 2005 |
|---|
| 4 | EE | Krishnakumar Sundaresan,
Paul S. Ho,
Siavash Pourkamali,
Farrokh Ayazi:
A two-chip, 4-MHz, microelectromechanical reference oscillator.
ISCAS (6) 2005: 5461-5464 |
| 3 | EE | Guotao Wang,
Paul S. Ho,
Steven Groothuis:
Chip-packaging interaction: a critical concern for Cu/low k packaging.
Microelectronics Reliability 45(7-8): 1079-1093 (2005) |
| 2004 |
|---|
| 2 | EE | Paul S. Ho,
Guotao Wang,
Min Ding,
Jie-Hua Zhao,
Xiang Dai:
Reliability issues for flip-chip packages.
Microelectronics Reliability 44(5): 719-737 (2004) |
| 2002 |
|---|
| 1 | EE | Jie-Hua Zhao,
Wen-Jie Qi,
Paul S. Ho:
Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures.
Microelectronics Reliability 42(1): 27-34 (2002) |
