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Bülent Sener

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2002
1EEWei Huang, James M. Loman, Bülent Sener: Study of the effect of reflow time and temperature on Cu-Sn intermetallic compound layer reliability. Microelectronics Reliability 42(8): 1229-1234 (2002)

Coauthor Index

1Wei Huang [1]
2James M. Loman [1]

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