| |
| 2004 | ||
|---|---|---|
| 2 | EE | A. Seppälä, Eero Ristolainen: Study of adhesive flip chip bonding process and failure mechanisms of ACA joints. Microelectronics Reliability 44(4): 639-648 (2004) |
| 2002 | ||
| 1 | EE | A. Seppälä, T. Allinniemi, Eero Ristolainen: Failure mechanisms of adhesive flip chip joints. Microelectronics Reliability 42(9-11): 1547-1550 (2002) |
| 1 | T. Allinniemi | [1] |
| 2 | Eero Ristolainen | [1] [2] |