| 2005 |
|---|
| 3 | EE | H. A. Post,
P. Letullier,
T. Briolat,
R. Humke,
R. Schuhmann,
K. Saarinen,
W. Werner,
Y. Ousten,
G. Lekens,
A. Dehbi:
Failure mechanisms and qualification testing of passive components.
Microelectronics Reliability 45(9-11): 1626-1632 (2005) |
| 2 | EE | A. Dehbi,
Y. Ousten,
Y. Danto,
W. Wondrak:
Vibration lifetime modelling of PCB assemblies using steinberg model.
Microelectronics Reliability 45(9-11): 1658-1661 (2005) |
| 2002 |
|---|
| 1 | EE | A. Dehbi,
W. Wondrak,
Y. Ousten,
Y. Danto:
High temperature reliability testing of aluminum and tantalum electrolytic capacitors.
Microelectronics Reliability 42(6): 835-840 (2002) |
