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A. Dehbi

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2005
3EEH. A. Post, P. Letullier, T. Briolat, R. Humke, R. Schuhmann, K. Saarinen, W. Werner, Y. Ousten, G. Lekens, A. Dehbi: Failure mechanisms and qualification testing of passive components. Microelectronics Reliability 45(9-11): 1626-1632 (2005)
2EEA. Dehbi, Y. Ousten, Y. Danto, W. Wondrak: Vibration lifetime modelling of PCB assemblies using steinberg model. Microelectronics Reliability 45(9-11): 1658-1661 (2005)
2002
1EEA. Dehbi, W. Wondrak, Y. Ousten, Y. Danto: High temperature reliability testing of aluminum and tantalum electrolytic capacitors. Microelectronics Reliability 42(6): 835-840 (2002)

Coauthor Index

1T. Briolat [3]
2Y. Danto [1] [2]
3R. Humke [3]
4G. Lekens [3]
5P. Letullier [3]
6Y. Ousten [1] [2] [3]
7H. A. Post [3]
8K. Saarinen [3]
9R. Schuhmann [3]
10W. Werner [3]
11W. Wondrak [1] [2]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)