| |
| 2002 | ||
|---|---|---|
| 3 | EE | De-Shin Liu, Chin-Yu Ni: The optimization design of bump interconnections in flip chip packages from the electrical standpoint. Microelectronics Reliability 42(12): 1893-1901 (2002) |
| 2 | EE | Chin-Yu Ni, De-Shin Liu, Ching-Yang Chen: Procedure for design optimization of a T-cap flip chip package. Microelectronics Reliability 42(12): 1903-1911 (2002) |
| 1 | EE | De-Shin Liu, Chin-Yu Ni: A thermo-mechanical study on the electrical resistance of aluminum wire conductors. Microelectronics Reliability 42(3): 367-374 (2002) |
| 1 | Ching-Yang Chen | [2] |
| 2 | De-Shin Liu | [1] [2] [3] |