2002 | ||
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1 | EE | P. Guilbault, E. Woirgard, C. Zardini, D. Lambert: Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations. Microelectronics Reliability 42(9-11): 1529-1533 (2002) |
1 | D. Lambert | [1] |
2 | E. Woirgard | [1] |
3 | C. Zardini | [1] |