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| 2002 | ||
|---|---|---|
| 1 | EE | C. Passagrilli, L. Gobbato, R. Tiziani: Reliability of Au/Al bonding in plastic packages for high temperature (200degreeC) and high current applications. Microelectronics Reliability 42(9-11): 1523-1528 (2002) |
| 1 | C. Passagrilli | [1] |
| 2 | R. Tiziani | [1] |