C. Pace

2002
1	EE	G. Scandurra, C. Ciofi, C. Pace, F. Speroni, F. Alagi: True constant temperature MTF test system for the characterization of electromigration of thick Cu interconnection lines. Microelectronics Reliability 42(9-11): 1347-1351 (2002)

Coauthor Index

1	F. Alagi	[1]
2	C. Ciofi	[1]
3	G. Scandurra	[1]
4	F. Speroni	[1]