| |
| 2002 | ||
|---|---|---|
| 2 | EE | Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard: Effect of substrate flexibility on solder joint reliability. Microelectronics Reliability 42(12): 1883-1891 (2002) |
| 2001 | ||
| 1 | EE | Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard: Stacked solder bumping technology for improved solder joint reliability. Microelectronics Reliability 41(12): 1979-1992 (2001) |
| 1 | David A. Dillard | [1] [2] |
| 2 | Xingsheng Liu | [1] [2] |
| 3 | Guo-Quan Lu | [1] [2] |