| |
| 2004 | ||
|---|---|---|
| 3 | EE | Frank Stepniak: Mechanical loading of flip chip joints before underfill: the impact on yield and reliability. Microelectronics Reliability 44(5): 805-814 (2004) |
| 2002 | ||
| 2 | EE | Frank Stepniak: Failure criteria of flip chip joints during accelerated testing. Microelectronics Reliability 42(12): 1921-1930 (2002) |
| 2001 | ||
| 1 | EE | Frank Stepniak: Conversion of the under bump metallurgy into intermetallics: the impact on flip chip reliability. Microelectronics Reliability 41(5): 735-744 (2001) |