| |
| 2004 | ||
|---|---|---|
| 2 | EE | Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie: Materials characterization of the effect of mechanical bending on area array package interconnects. Microelectronics Reliability 44(2): 275-285 (2004) |
| 2002 | ||
| 1 | EE | Dongji Xie, Sammy Yi: Reliability studies and design improvement of mirror image CSP assembly. Microelectronics Reliability 42(12): 1931-1937 (2002) |
| 1 | Doug Abbott | [2] |
| 2 | N. Todd Castello | [2] |
| 3 | Mike Cibulsky | [2] |
| 4 | Daniel T. Rooney | [2] |
| 5 | Sammy Yi | [1] |