| |
| 2002 | ||
|---|---|---|
| 1 | EE | G. Scandurra, C. Ciofi, C. Pace, F. Speroni, F. Alagi: True constant temperature MTF test system for the characterization of electromigration of thick Cu interconnection lines. Microelectronics Reliability 42(9-11): 1347-1351 (2002) |
| 1 | C. Ciofi | [1] |
| 2 | C. Pace | [1] |
| 3 | G. Scandurra | [1] |
| 4 | F. Speroni | [1] |