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| 2002 | ||
|---|---|---|
| 1 | EE | Andrew J. G. Strandjord, Scott Popelar, Christine Jauernig: Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding). Microelectronics Reliability 42(2): 265-283 (2002) |
| 1 | Scott Popelar | [1] |
| 2 | Andrew J. G. Strandjord | [1] |