Wen-Jie Qi

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2002

1 EE Jie-Hua Zhao, Wen-Jie Qi, Paul S. Ho: Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures. Microelectronics Reliability 42(1): 27-34 (2002)

2002
1	EE	Jie-Hua Zhao, Wen-Jie Qi, Paul S. Ho: Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures. Microelectronics Reliability 42(1): 27-34 (2002)

Coauthor Index

1 Paul S. Ho [1]

2 Jie-Hua Zhao [1]