| |
| 2004 | ||
|---|---|---|
| 2 | EE | S. Nurmi, J. Sundelin, Eero Ristolainen, T. Lepistö: The effect of solder paste composition on the reliability of SnAgCu joints. Microelectronics Reliability 44(3): 485-494 (2004) |
| 2002 | ||
| 1 | EE | T. Alander, S. Nurmi, P. Heino, Eero Ristolainen: Impact of component placement in solder joint reliability. Microelectronics Reliability 42(3): 399-406 (2002) |
| 1 | T. Alander | [1] |
| 2 | P. Heino | [1] |
| 3 | T. Lepistö | [2] |
| 4 | Eero Ristolainen | [1] [2] |
| 5 | J. Sundelin | [2] |