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G. Duchamp

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2002
1EEG. Duchamp, Y. Ousten, Y. Danto: Evaluation of a micropackaging analysis technique by highfrequency microwaves. Microelectronics Reliability 42(9-11): 1551-1554 (2002)

Coauthor Index

1Y. Danto [1]
2Y. Ousten [1]

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