| |
| 2005 | ||
|---|---|---|
| 2 | EE | L. Frisk, Eero Ristolainen: Flip chip attachment on flexible LCP substrate using an ACF. Microelectronics Reliability 45(3-4): 583-588 (2005) |
| 2002 | ||
| 1 | EE | L. Frisk, J. Järvinen, R. Ristolainen: Chip on flex attachment with thermoplastic ACF for RFID applications. Microelectronics Reliability 42(9-11): 1559-1562 (2002) |
| 1 | J. Järvinen | [1] |
| 2 | Eero Ristolainen | [2] |
| 3 | R. Ristolainen | [1] |