| |
| 2002 | ||
|---|---|---|
| 2 | EE | C. F. Luk, Y. C. Chan, K. C. Hung: Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. Microelectronics Reliability 42(3): 381-389 (2002) |
| 1 | EE | C. F. Luk, Y. C. Chan, K. C. Hung: Application of adhesive bonding techniques in hard disk drive head assembly. Microelectronics Reliability 42(4-5): 767-777 (2002) |
| 1 | Y. C. Chan | [1] [2] |
| 2 | K. C. Hung | [1] [2] |