2004 | ||
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2 | EE | S. C. Tan, Y. C. Chan, Y. W. Chiu, C. W. Tan: Thermal stability performance of anisotropic conductive film at different bonding temperatures. Microelectronics Reliability 44(3): 495-503 (2004) |
2002 | ||
1 | EE | Y. W. Chiu, Y. C. Chan, S. M. Lui: Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects. Microelectronics Reliability 42(12): 1945-1951 (2002) |
1 | Y. C. Chan | [1] [2] |
2 | S. M. Lui | [1] |
3 | C. W. Tan | [2] |
4 | S. C. Tan | [2] |