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| 2002 | ||
|---|---|---|
| 1 | EE | T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai: The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectronics Reliability 42(3): 375-380 (2002) |
| 1 | J. W. Chai | [1] |
| 2 | K. H. Chua | [1] |
| 3 | W. S. Leong | [1] |
| 4 | T. Y. Lin | [1] |
| 5 | Y. Miao | [1] |
| 6 | J. S. Pan | [1] |