| 2005 |
|---|
| 4 | EE | Y. C. Lin,
X. Chen,
Xingsheng Liu,
Guo-Quan Lu:
Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling.
Microelectronics Reliability 45(1): 143-154 (2005) |
| 2002 |
|---|
| 3 | EE | Xingsheng Liu,
Shuangyan Xu,
Guo-Quan Lu,
David A. Dillard:
Effect of substrate flexibility on solder joint reliability.
Microelectronics Reliability 42(12): 1883-1891 (2002) |
| 2001 |
|---|
| 2 | EE | Xingsheng Liu,
Shuangyan Xu,
Guo-Quan Lu,
David A. Dillard:
Stacked solder bumping technology for improved solder joint reliability.
Microelectronics Reliability 41(12): 1979-1992 (2001) |
| 1 | EE | Shatil Haque,
Kalyan Siddabattula,
Mike Craven,
Sihua Wen,
Xingsheng Liu,
Dusan Boroyevich,
Guo-Quan Lu:
Design issues of a three-dimensional packaging scheme for power modules.
Microelectronics Reliability 41(2): 295-305 (2001) |
