| |
| 2004 | ||
|---|---|---|
| 3 | EE | Teija Uusluoto, Paavo Jalonen, Harri Laaksonen, Aulis Tuominen: Metallization of microvias by sputter-deposition. Microelectronics Reliability 44(4): 587-593 (2004) |
| 2003 | ||
| 2 | EE | Paavo Jalonen: A new concept® for making fine line substrate for active component in polymer. Microelectronics Journal 34(2): 99-107 (2003) |
| 2002 | ||
| 1 | EE | Paavo Jalonen, Aulis Tuominen: The effect of sputtered interface metallic layers on reinforced core laminate making build-up structures. Microelectronics Reliability 42(7): 1075-1079 (2002) |
| 1 | Harri Laaksonen | [3] |
| 2 | Aulis Tuominen | [1] [3] |
| 3 | Teija Uusluoto | [3] |