T. Allinniemi
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2002
1
EE
A. Seppälä
, T. Allinniemi,
Eero Ristolainen
: Failure mechanisms of adhesive flip chip joints.
Microelectronics Reliability 42
(9-11): 1547-1550 (2002)
Coauthor
Index
1
Eero Ristolainen
[
1
]
2
A. Seppälä
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
