J. Bisschop

2002
1	EE	H. V. Nguyen, Cora Salm, J. Vroemen, J. Voets, B. Krabbenborg, J. Bisschop, A. J. Mouthaan, Fred G. Kuper: Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling. Microelectronics Reliability 42(9-11): 1415-1420 (2002)

Coauthor Index

1	B. Krabbenborg	[1]
2	Fred G. Kuper	[1]
3	A. J. Mouthaan	[1]
4	H. V. Nguyen	[1]
5	Cora Salm	[1]
6	J. Voets	[1]
7	J. Vroemen	[1]