| |
| 2002 | ||
|---|---|---|
| 1 | EE | Deok-Hoon Kim, Peter Elenius, Michael Johnson, Scott Barrett: Solder joint reliability of a polymer reinforced wafer level package. Microelectronics Reliability 42(12): 1837-1848 (2002) |
| 1 | Scott Barrett | [1] |
| 2 | Michael Johnson | [1] |
| 3 | Deok-Hoon Kim | [1] |