| |
| 2004 | ||
|---|---|---|
| 3 | EE | Jie-Hua Zhao: A three-parameter Weibull-like fitting function for flip-chip die strength data. Microelectronics Reliability 44(3): 459-470 (2004) |
| 2 | EE | Paul S. Ho, Guotao Wang, Min Ding, Jie-Hua Zhao, Xiang Dai: Reliability issues for flip-chip packages. Microelectronics Reliability 44(5): 719-737 (2004) |
| 2002 | ||
| 1 | EE | Jie-Hua Zhao, Wen-Jie Qi, Paul S. Ho: Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures. Microelectronics Reliability 42(1): 27-34 (2002) |
| 1 | Xiang Dai | [2] |
| 2 | Min Ding | [2] |
| 3 | Paul S. Ho | [1] [2] |
| 4 | Wen-Jie Qi | [1] |
| 5 | Guotao Wang | [2] |