2005 | ||
---|---|---|
2 | EE | B. Khong, P. Tounsi, Ph. Dupuy, X. Chauffleur, M. Legros, A. Deram, C. Levade, G. Vanderschaeve, J. M. Dorkel, J. P. Fradin: Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue. Microelectronics Reliability 45(9-11): 1717-1722 (2005) |
2002 | ||
1 | EE | O. Perat, J. M. Dorkel, E. Scheid, Pierre Temple-Boyer, Y. S. Chung, A. Peyre-Lavigne, M. Zecri, P. Tounsi: Characterization method of thermomechanical parameters for microelectronic materials. Microelectronics Reliability 42(7): 1053-1058 (2002) |
1 | X. Chauffleur | [2] |
2 | Y. S. Chung | [1] |
3 | A. Deram | [2] |
4 | J. M. Dorkel | [1] [2] |
5 | Ph. Dupuy | [2] |
6 | J. P. Fradin | [2] |
7 | B. Khong | [2] |
8 | M. Legros | [2] |
9 | C. Levade | [2] |
10 | O. Perat | [1] |
11 | A. Peyre-Lavigne | [1] |
12 | E. Scheid | [1] |
13 | Pierre Temple-Boyer | [1] |
14 | G. Vanderschaeve | [2] |
15 | M. Zecri | [1] |