| |
| 2005 | ||
|---|---|---|
| 2 | EE | Edmund D. Blackshear, Moises Cases, Erich Klink, Stephen R. Engle, Ronald S. Malfatt, Daniel N. deAraujo, Stefano Oggioni, Luke D. Lacroix, Jamil A. Wakil, Nam H. Pham, Gareth G. Hougham, David J. Russell: The evolution of build-up package technology and its design challenges. IBM Journal of Research and Development 49(4-5): 641-662 (2005) |
| 2002 | ||
| 1 | EE | Giulio Di Giacomo, Stefano Oggioni: Reliability of Flip Chip Applications with Ceramic and Organic Chip Carriers. Microelectronics Reliability 42(9-11): 1541-1546 (2002) |
| 1 | Edmund D. Blackshear | [2] |
| 2 | Moises Cases | [2] |
| 3 | Stephen R. Engle | [2] |
| 4 | Giulio Di Giacomo | [1] |
| 5 | Gareth G. Hougham | [2] |
| 6 | Erich Klink | [2] |
| 7 | Luke D. Lacroix | [2] |
| 8 | Ronald S. Malfatt | [2] |
| 9 | Nam H. Pham | [2] |
| 10 | David J. Russell | [2] |
| 11 | Jamil A. Wakil | [2] |
| 12 | Daniel N. deAraujo | [2] |