James M. Loman

List of publications from the DBLP Bibliography Server - FAQ

2002

1 EE Wei Huang, James M. Loman, Bülent Sener: Study of the effect of reflow time and temperature on Cu-Sn intermetallic compound layer reliability. Microelectronics Reliability 42(8): 1229-1234 (2002)

2002
1	EE	Wei Huang, James M. Loman, Bülent Sener: Study of the effect of reflow time and temperature on Cu-Sn intermetallic compound layer reliability. Microelectronics Reliability 42(8): 1229-1234 (2002)

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