| |
| 2002 | ||
|---|---|---|
| 1 | EE | O. Perat, J. M. Dorkel, E. Scheid, Pierre Temple-Boyer, Y. S. Chung, A. Peyre-Lavigne, M. Zecri, P. Tounsi: Characterization method of thermomechanical parameters for microelectronic materials. Microelectronics Reliability 42(7): 1053-1058 (2002) |
| 1 | Y. S. Chung | [1] |
| 2 | J. M. Dorkel | [1] |
| 3 | O. Perat | [1] |
| 4 | A. Peyre-Lavigne | [1] |
| 5 | Pierre Temple-Boyer | [1] |
| 6 | P. Tounsi | [1] |
| 7 | M. Zecri | [1] |