2004 |
3 | EE | Jiri Jakovenko,
Miroslav Husak,
Tibor Lalinsky:
Design and simulation of micromechanical thermal converter for RF power sensor microsystem.
Microelectronics Reliability 44(1): 141-148 (2004) |
2003 |
2 | EE | Tibor Lalinsky,
M. Krnac,
S. Hascik,
Z. Mozolova,
L. Matay,
I. Kostic,
P. Hrkut,
Jiri Jakovenko,
Miroslav Husak:
Micromechanical Thermal Converter Device Based On Polyimide-Fixed Island Structure.
International Journal of Computational Engineering Science 4(3): 543-546 (2003) |
2002 |
1 | EE | Dionyz Pogany,
J. Kuzmik,
J. Darmo,
Martin Litzenberger,
Scrgey Bychikhin,
K. Unterrainer,
Z. Mozolova,
S. Hascik,
Tibor Lalinsky,
E. Gornik:
Electrical field mapping in InGaP HEMTs and GaAs terahertz emitters using backside infrared OBIC technique.
Microelectronics Reliability 42(9-11): 1673-1677 (2002) |