H. V. Nguyen

2002
2	EE	H. V. Nguyen, Cora Salm, J. Vroemen, J. Voets, B. Krabbenborg, J. Bisschop, A. J. Mouthaan, Fred G. Kuper: Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling. Microelectronics Reliability 42(9-11): 1415-1420 (2002)
1	EE	H. V. Nguyen, Cora Salm, R. Wenzel, A. J. Mouthaan, Fred G. Kuper: Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime. Microelectronics Reliability 42(9-11): 1421-1425 (2002)

Coauthor Index

1	J. Bisschop	[2]
2	B. Krabbenborg	[2]
3	Fred G. Kuper	[1] [2]
4	A. J. Mouthaan	[1] [2]
5	Cora Salm	[1] [2]
6	J. Voets	[2]
7	J. Vroemen	[2]
8	R. Wenzel	[1]