| 2002 |
|---|
| 7 | EE | C. F. Luk,
Y. C. Chan,
K. C. Hung:
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies.
Microelectronics Reliability 42(3): 381-389 (2002) |
| 6 | EE | C. F. Luk,
Y. C. Chan,
K. C. Hung:
Application of adhesive bonding techniques in hard disk drive head assembly.
Microelectronics Reliability 42(4-5): 767-777 (2002) |
| 5 | EE | M. O. Alam,
Y. C. Chan,
K. C. Hung:
Reliability study of the electroless Ni-P layer against solder alloy.
Microelectronics Reliability 42(7): 1065-1073 (2002) |
| 4 | EE | Hua Lu,
K. C. Hung,
S. Stoyanov,
C. Bailey,
Y. C. Chan:
No-flow underfill flip chip assembly--an experimental and modeling analysis.
Microelectronics Reliability 42(8): 1205-1212 (2002) |
| 2001 |
|---|
| 3 | EE | Y. C. Chan,
P. L. Tu,
K. C. Hung:
Study of the self-alignment of no-flow underfill for micro-BGA assembly.
Microelectronics Reliability 41(11): 1867-1875 (2001) |
| 2 | EE | P. L. Tu,
Y. C. Chan,
K. C. Hung:
Reliability of microBGA assembly using no-flow underfill.
Microelectronics Reliability 41(12): 1993-2000 (2001) |
| 1 | EE | P. L. Tu,
Y. C. Chan,
K. C. Hung,
J. K. L. Lai:
Study of micro-BGA solder joint reliability.
Microelectronics Reliability 41(2): 287-293 (2001) |
