Rajendra D. Pendse
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2002
1
EE
Rajendra D. Pendse,
Peng Zhou
: Methodology for predicting solder joint reliability in semiconductor packages.
Microelectronics Reliability 42
(2): 301-305 (2002)
Coauthor
Index
1
Peng Zhou
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
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