C. Passagrilli

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2002

1 EE C. Passagrilli, L. Gobbato, R. Tiziani: Reliability of Au/Al bonding in plastic packages for high temperature (200degreeC) and high current applications. Microelectronics Reliability 42(9-11): 1523-1528 (2002)

2002
1	EE	C. Passagrilli, L. Gobbato, R. Tiziani: Reliability of Au/Al bonding in plastic packages for high temperature (200degreeC) and high current applications. Microelectronics Reliability 42(9-11): 1523-1528 (2002)

Coauthor Index

1 L. Gobbato [1]

2 R. Tiziani [1]