| |
| 2002 | ||
|---|---|---|
| 1 | EE | Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl: Bump formation for flip chip and CSP by solder paste printing. Microelectronics Reliability 42(3): 391-398 (2002) |
| 1 | Rolf Aschenbrenner | [1] |
| 2 | Paradiso Coskina | [1] |
| 3 | Herbert Reichl | [1] |