J. M. Dorkel

2005
2	EE	B. Khong, P. Tounsi, Ph. Dupuy, X. Chauffleur, M. Legros, A. Deram, C. Levade, G. Vanderschaeve, J. M. Dorkel, J. P. Fradin: Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue. Microelectronics Reliability 45(9-11): 1717-1722 (2005)
2002
1	EE	O. Perat, J. M. Dorkel, E. Scheid, Pierre Temple-Boyer, Y. S. Chung, A. Peyre-Lavigne, M. Zecri, P. Tounsi: Characterization method of thermomechanical parameters for microelectronic materials. Microelectronics Reliability 42(7): 1053-1058 (2002)

Coauthor Index

1	X. Chauffleur	[2]
2	Y. S. Chung	[1]
3	A. Deram	[2]
4	Ph. Dupuy	[2]
5	J. P. Fradin	[2]
6	B. Khong	[2]
7	M. Legros	[2]
8	C. Levade	[2]
9	O. Perat	[1]
10	A. Peyre-Lavigne	[1]
11	E. Scheid	[1]
12	Pierre Temple-Boyer	[1]
13	P. Tounsi	[1] [2]
14	G. Vanderschaeve	[2]
15	M. Zecri	[1]