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| 2002 | ||
|---|---|---|
| 2 | EE | Y. C. Chan, D. Y. Luk: Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature. Microelectronics Reliability 42(8): 1185-1194 (2002) |
| 1 | EE | Y. C. Chan, D. Y. Luk: Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure. Microelectronics Reliability 42(8): 1195-1204 (2002) |
| 1 | Y. C. Chan | [1] [2] |