| |
| 2002 | ||
|---|---|---|
| 2 | EE | Silke Liebert: Encapsulation of naked dies for bulk silicon etching with TMAH. Microelectronics Reliability 42(12): 1939-1944 (2002) |
| 2001 | ||
| 1 | EE | Silke Liebert: Failure analysis from the back side of a die. Microelectronics Reliability 41(8): 1193-1201 (2001) |