Microelectronics Reliability, Volume 44

Volume 44, Number 1, January 2004

• Enrique Miranda, Jordi Suñé:
  Electron transport through broken down ultra-thin SiO₂ layers in MOS devices. 1-23
  Electronic Edition (link) BibTeX
• M. M. De Souza, S. K. Manhas, D. Chandra Sekhar, A. S. Oates, Prasad Chaparala:
  Influence of mobility model on extraction of stress dependent source-drain series resistance. 25-32
  Electronic Edition (link) BibTeX
• Steven H. Voldman:
  A review of electrostatic discharge (ESD) in advanced semiconductor technology. 33-46
  Electronic Edition (link) BibTeX
• Hyuck In Kwon, In Man Kang, Byung-Gook Park, Jong Duk Lee, Sang Sik Park, Jung Chak Ahn, Yong Hee Lee:
  Effects of electrical stress on mid-gap interface trap density and capture cross sections in n-MOSFETs characterized by pulsed interface probing measurements. 47-51
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• Mohamed A. Imam, Mohamed A. Osman, Ashraf A. Osman:
  Simulation of partially and near fully depleted SOI MOSFET devices and circuits using SPICE compatible physical subcircuit model. 53-63
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• A. Bravaix, D. Goguenheim, N. Revil, E. Vincent:
  Hole injection enhanced hot-carrier degradation in PMOSFETs used for systems on chip applications with 6.5-2 nm thick gate-oxides. 65-77
  Electronic Edition (link) BibTeX
• G. Bonnet, P. Austin, J. L. Sanchez:
  New distributed model of NPT IGBT dedicated to power circuits design. 79-88
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• Enhai Zhao, Zeynep Çelik-Butler, Frank Thiel, Ranadeep Dutta:
  Origin of 1/f noise in lateral PNP bipolar transistors. 89-94
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• Josep Altet, J. M. Rampnoux, Jean-Christophe Batsale, Stefan Dilhaire, Antonio Rubio, Wilfrid Claeys, Stéphane Grauby:
  Applications of temperature phase measurements to IC testing. 95-103
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• Tong Yan Tee, Zhaowei Zhong:
  Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis. 105-114
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• P. Towashiraporn, G. Subbarayan, B. McIlvanie, B. C. Hunter, D. Love, B. Sullivan:
  The effect of model building on the accuracy of fatigue life predictions in electronic packages. 115-127
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• Rajendra M. Patrikar, K. Murali, Li Er Ping:
  Thermal distribution calculations for block level placement in embedded systems. 129-134
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• Jad S. Rasul:
  Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications. 135-140
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• Jiri Jakovenko, Miroslav Husak, Tibor Lalinsky:
  Design and simulation of micromechanical thermal converter for RF power sensor microsystem. 141-148
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• Taizo Tomioka, Tomohiro Iguchi, Ikuo Mori:
  Thermosonic flip-chip bonding for SAW filter. 149-154
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• Jong-heon Kim, In-Soo Kang, Chi-jung Song, Young-Jik Hur, Hak-Nam Kim, Esdy Baek, Tae-Jun Seo:
  Flip-chip packaging solution for CMOS image sensor device. 155-161
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• E. Miranda, E. Mallaina:
  Single-equation model for low and high voltage soft breakdown conduction. 163-166
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• K. S. Kim, H. I. Kim, C. H. Yu, E. G. Chang:
  Fatigue analysis of high-speed photodiode submodule by using FEM. 167-171
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• Mile K. Stojcev, Goran L. Djordjevic, Tatjana R. Stankovic:
  Implementation of self-checking two-level combinational logic on FPGA and CPLD circuits. 173-178
  Electronic Edition (link) BibTeX
• Mile K. Stojcev:
  System on chip design languages; Anne Mignotte, Eugenio Villar, Lynn Horobin, editors, Kluwer Academic Publishers, Boston, 2002. Hardcover, pp 283, plus IX, ISBN 1-4020-7046-2. 179
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• Mile K. Stojcev:
  Design criteria for low distortion in feedback OPAMP circuits; Bjornar Hernes, Trond Saether, Kluwer Academic Publishers, Boston, 2003. Hardcover, pp 160, plus XXV, ISBN 1-4020-7356-9. 181-182
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Volume 44, Number 2, February 2004

• Young-Hee Kim, Jack C. Lee:
  Reliability characteristics of high-k dielectrics. 183-193
  Electronic Edition (link) BibTeX
• Christine S. Hau-Riege:
  An introduction to Cu electromigration. 195-205
  Electronic Edition (link) BibTeX
• Yi-Mu Lee, Yider Wu, Gerald Lucovsky:
  Breakdown and reliability of p-MOS devices with stacked RPECVD oxide/nitride gate dielectric under constant voltage stress. 207-212
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• Chih-Yao Huang, Wei-Fang Chen, Song-Yu Chuan, Fu-Chien Chiu, Jeng-Chou Tseng, I-Cheng Lin, Chuan-Jane Chao, Len-Yi Leu, Ming-Dou Ker:
  Design optimization of ESD protection and latchup prevention for a serial I/O IC. 213-221
  Electronic Edition (link) BibTeX
• A. Bouhdada, R. Marrakh, F. Vigué, J.-P. Faurie:
  Modeling of the spectral response of PIN photodetectors Impact of exposed zone thickness, surface recombination velocity and trap concentration. 223-228
  Electronic Edition (link) BibTeX
• Takeshi Yanagisawa, Takeshi Kojima, Tadamasa Koyanagi:
  Behavior of Cu(In, Ga)Se₂ solar cells under light/damp heat over time. 229-235
  Electronic Edition (link) BibTeX
• Hyun Ho Kim, Byeong Kwon Ju, Yun Hi Lee, Si Hyung Lee, Jeon Kook Lee, Soo Won Kim:
  Fabrication of suspended thin film resonator for application of RF bandpass filter. 237-243
  Electronic Edition (link) BibTeX
• Simone Lee, Ramesh Ramadoss, Michael Buck, V. M. Bright, K. C. Gupta, Y. C. Lee:
  Reliability testing of flexible printed circuit-based RF MEMS capacitive switches. 245-250
  Electronic Edition (link) BibTeX
• Yi Tao, Ajay P. Malshe, William D. Brown:
  Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems. 251-258
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• Jason Y. L. Goh, Mark C. Pitter, Chung W. See, Michael G. Somekh, Daniel Vanderstraeten:
  Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages. 259-267
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• Ikuo Shohji, Hideo Mori, Yasumitsu Orii:
  Solder joint reliability evaluation of chip scale package using a modified Coffin-Manson equation. 269-274
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• Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie:
  Materials characterization of the effect of mechanical bending on area array package interconnects. 275-285
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• Cristina Lopez, Liang Chai, Aziz Shaikh, Vern Stygar:
  Wire bonding characteristics of gold conductors for low temperature co-fired ceramic applications. 287-294
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• Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu:
  Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. 295-302
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• Katsuhito Yoshida, Hideaki Morigami:
  Thermal properties of diamond/copper composite material. 303-308
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• Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl:
  Long time reliability study of soldered flip chips on flexible substrates. 309-314
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• Seok Hwan Moon, Gunn Hwang, Sang Choon Ko, Youn Tae Kim:
  Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon. 315-321
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• Esther Wai Ching Yau, Jing Feng Gong, Philip Chan:
  Al surface morphology effect on flip-chip solder bump shear strength. 323-331
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• Arun Ramakrishnan, Michael G. Pecht:
  Load characterization during transportation. 333-338
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• Juan A. Carrasco, Víctor Suñé:
  Combinatorial methods for the evaluation of yield and operational reliability of fault-tolerant systems-on-chip. 339-350
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• W. Dabrowski, P. Grybos, T. Fiutowski:
  Design for good matching in multichannel low-noise amplifier for recording neuronal signals in modern neuroscience experiments. 351-361
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• Mile K. Stojcev:
  Interconnecting and Computing over Satellite Networks; Yongguang Zhang (Ed.). Kluwer Academic Publishers, Boston, 2003. Hardcover, pp 262, plus XXII, ISBN 1-4020-7424-7. 363-364
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Volume 44, Number 3, March 2004

• Baozhen Li, Timothy D. Sullivan, Tom C. Lee, Dinesh Badami:
  Reliability challenges for copper interconnects. 365-380
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• Ming-C. Cheng, Feixia Yu, Lin Jun, Min Shen, Goodarz Ahmadi:
  Steady-state and dynamic thermal models for heat flow analysis of silicon-on-insulator MOSFETs. 381-396
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• Gregory Freeman, Jae-Sung Rieh, Zhijian Yang, Fernando J. Guarín:
  Reliability and performance scaling of very high speed SiGe HBTs. 397-410
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• K.-H. Allers:
  Prediction of dielectric reliability from I-V characteristics: Poole-Frenkel conduction mechanism leading to sqrt(E) model for silicon nitride MIM capacitor. 411-423
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• Kyungmee O. Kim, Way Kuo, Wen Luo:
  A relation model of gate oxide yield and reliability. 425-434
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• Xiangbin Zeng, X. W. Sun, Junfeng Li, Johnny K. O. Sin:
  Improving reliability of poly-Si TFTs with channel layer and gate oxide passivated by NH₃/N₂O plasma. 435-442
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• Pierre Temple-Boyer, J. Launay, I. Humenyuk, T. Do Conto, A. Martinez, C. Bériet, A. Grisel:
  Study of front-side connected chemical field effect transistor for water analysis. 443-447
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• S. Nakajima, S. Nakamura, T. Ueki, T. Sakai:
  Sample preparation techniques for physical analysis of VLSIs. 449-458
  Electronic Edition (link) BibTeX
• Jie-Hua Zhao:
  A three-parameter Weibull-like fitting function for flip-chip die strength data. 459-470
  Electronic Edition (link) BibTeX
• Yu Gu, Toshio Nakamura:
  Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages. 471-483
  Electronic Edition (link) BibTeX
• S. Nurmi, J. Sundelin, Eero Ristolainen, T. Lepistö:
  The effect of solder paste composition on the reliability of SnAgCu joints. 485-494
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• S. C. Tan, Y. C. Chan, Y. W. Chiu, C. W. Tan:
  Thermal stability performance of anisotropic conductive film at different bonding temperatures. 495-503
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• M. A. Uddin, M. O. Alam, Y. C. Chan, H. P. Chan:
  Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. 505-514
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• Tadanori Shimoto, Katsumi Kikuchi, Kazuhiro Baba, Koji Matsui, Hirokazu Honda, Keiichiro Kata:
  High-performance FCBGA based on multi-layer thin-substrate packaging technology. 515-520
  Electronic Edition (link) BibTeX
• Beth Keser, Li Wetz, Jerry White:
  WL-CSP reliability with various solder alloys and die thicknesses. 521-531
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• Li Zhang, Vivek Arora, Luu Nguyen, Nikhil Kelkar:
  Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages. 533-541
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• R. Khlil, A. El Hdiy, A. F. Shulekin, S. E. Tyaginov, M. I. Vexler:
  Soft breakdown of MOS tunnel diodes with a spatially non-uniform oxide thickness. 543-546
  Electronic Edition (link) BibTeX
• Mile K. Stojcev:
  Power-Constrained Testing of VLSI Circuits. Nikola Nikolici, Bashir M. Al-Hashimi. Kluwer Academic Publishers, Boston, 2003. Hardcover, pp 178, plus XI, ISBN 1-4020-7235-X. 547-548
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Volume 44, Number 4, April 2004

• Jorge Salcedo-Suñer, Charvaka Duvvury, Roger Cline, Alfonso Cadena-Hernandez:
  Latchup in voltage tolerant circuits: a new phenomenon. 549-562
  Electronic Edition (link) BibTeX
• J. A. Felix, J. R. Schwank, D. M. Fleetwood, M. R. Shaneyfelt, Evgeni P. Gusev:
  Effects of radiation and charge trapping on the reliability of high-kappa gate dielectrics. 563-575
  Electronic Edition (link) BibTeX
• P. T. Lai, J. P. Xu, H. P. Wu, C. L. Chan:
  Interfacial properties and reliability of SiO₂ grown on 6H-SiC in dry O₂ plus trichloroethylene. 577-580
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• Guo Lihui, Zhang Yibin, Su Yong Jie Jeffrey:
  Integrating thick copper/Black Diamond^TM layer in CMOS interconnect process for RF passive components. 581-585
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• Teija Uusluoto, Paavo Jalonen, Harri Laaksonen, Aulis Tuominen:
  Metallization of microvias by sputter-deposition. 587-593
  Electronic Edition (link) BibTeX
• N. H. Yeung, Victor Lau, Y. C. Chan:
  Bias-HAST on tape ball grid array (TBGA) test pattern. 595-602
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• T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma:
  The impact of moisture in mold compound preforms on the warpage of PBGA packages. 603-609
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• Xiaowu Zhang, E. H. Wong, Charles Lee, Tai-Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath:
  Thermo-mechanical finite element analysis in a multichip build up substrate based package design. 611-619
  Electronic Edition (link) BibTeX
• Kyoungsoon Cho, Insu Jeon:
  Numerical analysis of the warpage problem in TSOP. 621-626
  Electronic Edition (link) BibTeX
• Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang:
  Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. 627-638
  Electronic Edition (link) BibTeX
• A. Seppälä, Eero Ristolainen:
  Study of adhesive flip chip bonding process and failure mechanisms of ACA joints. 639-648
  Electronic Edition (link) BibTeX
• Juan Santana, Magali Estrada, Ofelia Martinez:
  Editorial. 649
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• I. León, R. Amador, K. Kohlhof:
  Evaluation of MUMPS polysilicon structures for thermal flow sensors. 651-655
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• Fernando da Rocha Paixão Cortes, Eric E. Fabris, Sergio Bampi:
  Analysis and design of amplifiers and comparators in CMOS 0.35 mum technology. 657-664
  Electronic Edition (link) BibTeX
• Alessandro Girardi, Sergio Bampi:
  AC analysis of an inverter amplifier using minimum-length trapezoidal association of transistors. 665-671
  Electronic Edition (link) BibTeX
• José Ernesto Rayas-Sánchez:
  A frequency-domain approach to interconnect crosstalk simulation and minimization. 673-681
  Electronic Edition (link) BibTeX
• J. Louzao, S. Paz, D. Tejera, G. Bellora, Guillermo Langwagen:
  Architectural design of a programmable cell for the implementation of a filter bank on FPGA. 683-695
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• Luciano Volcan Agostini, Ivan Saraiva Silva, Sergio Bampi:
  Parallel color space converters for JPEG image compression. 697-703
  Electronic Edition (link) BibTeX
• Gang Qu, Miodrag Potkonjak, Mile K. Stojcev:
  Book review: Intellectual property protection in VLSI designs: Theory and practice, Hardcover, pp 183, plus XIX, Kluwer Academic Publishers, Boston, 2003, ISBN 1-4020-7320-8. 705-706
  Electronic Edition (link) BibTeX
• Mile K. Stojcev:
  Power estimation and optimization for VLIW-based embedded systems; Vittorio Zaccaria, Mariagiovanna Sami, Donatella Sciuto, Cristina Silvano. Hardcover, pp 203, plus XXIV, Kluwer Academic Publishers, Boston, 2003. ISBN 1-4020-7377-1. 707-708
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Volume 44, Number 5, May 2004

• B. L. Yang, P. T. Lai, H. Wong:
  Conduction mechanisms in MOS gate dielectric films. 709-718
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• Paul S. Ho, Guotao Wang, Min Ding, Jie-Hua Zhao, Xiang Dai:
  Reliability issues for flip-chip packages. 719-737
  Electronic Edition (link) BibTeX
• Domenico Caputo, Fernanda Irrera:
  On the reliability of ZrO₂ films for VLSI applications. 739-745
  Electronic Edition (link) BibTeX
• A. V. Vairagar, S. G. Mhaisalkar, Ahila Krishnamoorthy:
  Electromigration behavior of dual-damascene Cu interconnects--Structure, width, and length dependences. 747-754
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• Peter Z. F. Shi, Albert C. W. Lu, Y. M. Tan, Stephen C. K. Wong, Eric Tan, Ronson Tan:
  Thermal design and experimental validation for optical transmitters. 755-769
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• Yoshiteru Yamada, Hirotaka Komoda:
  An example of fault site localization on a 0.18 mum CMOS device with combination of front and backside techniques. 771-778
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• Zhimin Mo, Helge Kristiansen, Morten Eliassen, Shiming Li, Johan Liu:
  Study on thermomechanical reliability of a tunable light modulator. 779-785
  Electronic Edition (link) BibTeX
• Mark A. Fritz, Daniel T. Cassidy:
  Extraction of bonding strain data in diode lasers from polarization-resolved photoluminescence measurements. 787-796
  Electronic Edition (link) BibTeX
• Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl:
  Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. 797-803
  Electronic Edition (link) BibTeX
• Frank Stepniak:
  Mechanical loading of flip chip joints before underfill: the impact on yield and reliability. 805-814
  Electronic Edition (link) BibTeX
• Rashed Adnan Islam, Y. C. Chan:
  Effect of microwave preheating on the bonding performance of flip chip on flex joint. 815-821
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• C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So:
  Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. 823-831
  Electronic Edition (link) BibTeX
• Jinlin Wang, H. K. Lim, H. S. Lew, Woon Theng Saw, Chew Hong Tan:
  A testing method for assessing solder joint reliability of FCBGA packages. 833-840
  Electronic Edition (link) BibTeX
• X. Q. Shi, H. L. J. Pang, X. R. Zhang:
  Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. 841-852
  Electronic Edition (link) BibTeX
• L. Han, Arkady Voloshin:
  Statistical analysis for test lands positioning and PCB deformation during electrical testing. 853-859
  Electronic Edition (link) BibTeX
• Pawel Sniatala, André S. Botha:
  A/D converter based on a new memory cell implemented using the switched current technique. 861-867
  Electronic Edition (link) BibTeX
• Aránzazu Otín, Santiago Celma, Concepción Aldea:
  Digitally programmable CMOS transconductor for very high frequency. 869-875
  Electronic Edition (link) BibTeX
• O. Mitrea, Manfred Glesner:
  A power-constrained design strategy for CMOS tuned low noise amplifiers. 877-883
  Electronic Edition (link) BibTeX
• V. Sánchez, J. Munguía, M. Estrada:
  Photo-CVD process for ultra thin SiO₂ films. 885-888
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Volume 44, Number 6, June 2004

• Vassil Palankovski, Siegfried Selberherr:
  Rigorous modeling of high-speed semiconductor devices. 889-897
  Electronic Edition (link) BibTeX
• D. Dubuc, M. Saddaoui, S. Mellé, F. Flourens, L. Rabbia, B. Ducarouge, K. Grenier, P. Pons, A. Boukabache, L. Bary:
  Smart MEMS concept for high secure RF and millimeterwave communications. 899-907
  Electronic Edition (link) BibTeX
• R.-P. Vollertsen, E. Y. Wu:
  Voltage acceleration and t63.2 of 1.6-10 nm gate oxides. 909-916
  Electronic Edition (link) BibTeX
• Insu Jeon, Young-Bae Park:
  Analysis of the reservoir effect on electromigration reliability. 917-928
  Electronic Edition (link) BibTeX
• Z. Khatir, S. Lefebvre:
  Boundary element analysis of thermal fatigue effects on high power IGBT modules. 929-938
  Electronic Edition (link) BibTeX
• M. Dammann, A. Leuther, Rüdiger Quay, M. Meng, H. Konstanzer, W. Jantz, Michael Mikulla:
  Reliability of 70 nm metamorphic HEMTs. 939-943
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• Hassène Mnif, Thomas Zimmer, Jean Luc Battaglia, Sébastien Fregonese:
  Representation of the SiGe HBT's thermal impedance by linear and recursive networks. 945-950
  Electronic Edition (link) BibTeX
• Yu Ying, Peter Grant:
  Deformation measurement of RF MEMS switches by optical interference. 951-955
  Electronic Edition (link) BibTeX
• Yingxue Shi, Jing Li, Guijun Hu, Sumei Zhang, Xuedan Wang, Jiawei Shi:
  Effects of annealing on the electric noise in semiconductor lasers. 957-961
  Electronic Edition (link) BibTeX
• Z. Radivojevic, K. Andersson, J. A. Bielen, P. J. van der Wel, J. Rantala:
  Operating limits for RF power amplifiers at high junction temperatures. 963-972
  Electronic Edition (link) BibTeX
• C. D. Breach, F. Wulff:
  New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au₄Al. 973-981
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• J. M. Kim, Y. E. Shin, K. Fujimoto:
  Dynamic modeling for resin self-alignment mechanism. 983-992
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• Markus P. K. Turunen, Pekka Marjamäki, Matti Paajanen, Jouko Lahtinen, Jorma K. Kivilahti:
  Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface. 993-1007
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• Frøydis Oldervoll, Frode Strisland:
  Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures. 1009-1015
  Electronic Edition (link) BibTeX
• Alireza Ejlali, Seyed Ghassem Miremadi:
  FPGA-based Monte Carlo simulation for fault tree analysis. 1017-1028
  Electronic Edition (link) BibTeX
• Mile K. Stojcev:
  Oversampled delta-sigma modulators: analysis applications and novel topologies; Mücahit Kozak, Izzet Kale. Kluwer Academic Publishers, Boston. 2003. Hardcover, pp 226, plus XII, ISBN 1-4020-7420-4. 1029
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Volume 44, Number 7, July 2004

• Peter Ersland, Roberto Menozzi:
  Editorial. 1031
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• Y. C. Chou, D. Leung, I. Smorchkova, M. Wojtowicz, R. Grundbacher, L. Callejo, Q. Kan, R. Lai, P. H. Liu, D. Eng:
  Degradation of AlGaN/GaN HEMTs under elevated temperature lifetesting. 1033-1038
  Electronic Edition (link) BibTeX
• Peter Ersland, Hei-Ruey Jen, Xinxing Yang:
  Lifetime acceleration model for HAST tests of a pHEMT process. 1039-1045
  Electronic Edition (link) BibTeX
• William J. Roesch, Suwanna Jittinorasett:
  Cycling copper flip chip interconnects. 1047-1054
  Electronic Edition (link) BibTeX
• Bruce M. Paine, Timothy J. Perham, Stephen Thomas III:
  High-resolution transmission electron microscopy on aged InP HBTs. 1055-1060
  Electronic Edition (link) BibTeX
• Satbir S. Madra:
  Role of carrier depletion effects and material properties in advanced microscale thermal modeling of N-GaInP-Si/p-GaAs-C heterojunction bipolar transistor (HBT) devices. 1061-1068
  Electronic Edition (link) BibTeX
• Chun-Hsing Shih, Yi-Min Chen, Chenhsin Lien:
  Design strategy of localized halo profile for achieving sub-50 nm bulk MOSFET. 1069-1075
  Electronic Edition (link) BibTeX
• M. Marin, Y. Akue Allogo, M. de Murcia, P. Llinares, J. C. Vildeuil:
  Low frequency noise characterization in 0.13 mum p-MOSFETs. Impact of scaled-down 0.25, 0.18 and 0.13 mum technologies on 1/f noise. 1077-1085
  Electronic Edition (link) BibTeX
• Qungang Ma, Yuejin Li, Yintang Yang:
  Study of swing potential on deep submicron on-chip interconnect. 1087-1091
  Electronic Edition (link) BibTeX
• T. K. Chiang:
  A two-dimensional analytical subthreshold behavior model for short-channel AlGaAs/GaAs HFETs. 1093-1099
  Electronic Edition (link) BibTeX
• L. Yang, Asen Asenov, J. R. Watling, M. Boriçi, J. R. Barker, Scott Roy, K. Elgaid, I. Thayne, T. Hackbarth:
  Impact of device geometry and doping strategy on linearity and RF performance in Si/SiGe MODFETs. 1101-1107
  Electronic Edition (link) BibTeX
• A. Sozza, C. Dua, A. Kerlain, C. Brylinski, E. Zanoni:
  Long-term reliability of Ti-Pt-Au metallization system for Schottky contact and first-level metallization on SiC MESFET. 1109-1113
  Electronic Edition (link) BibTeX
• Adam Golda, Andrzej Kos:
  Temperature influence on energy losses in MOSFET capacitors. 1115-1121
  Electronic Edition (link) BibTeX
• Milan Jevtic:
  Low frequency noise as a tool to study optocouplers with phototransistors. 1123-1129
  Electronic Edition (link) BibTeX
• Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong:
  Impact life prediction modeling of TFBGA packages under board level drop test. 1131-1142
  Electronic Edition (link) BibTeX
• Hongfang Wang, Mei Zhao, Qiang Guo:
  Vibration fatigue experiments of SMT solder joint. 1143-1156
  Electronic Edition (link) BibTeX
• Ashish Batra, Pradeep Ramachandran, Poornima Sathyanarayanan, Susan Lu, Hari Srihari:
  Reliability enhancement of electronic packages by design of optimal parameters. 1157-1163
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• Hyong Tae Kim, Chang Seop Song, Hae Jeong Yang:
  2-Step algorithm for automatic alignment in wafer dicing process. 1165-1179
  Electronic Edition (link) BibTeX
• Octavio A. Leon, Gilbert De Mey, Erik Dick, Jan A. Vierendeels:
  Staggered heat sinks with aerodynamic cooling fins. 1181-1187
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• Belén Calvo, Santiago Celma, Maria Teresa Sanz, Pedro A. Martínez:
  A high-linear wide-tunable CMOS transconductor for video frequency applications. 1189-1198
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• Y. L. Goh, D. S. Ong:
  Analytical investigation of dead space effect under near-breakdown conditions in GaInP/GaAs composite double heterojunction bipolar transistors. 1199-1202
  Electronic Edition (link) BibTeX
• Mile K. Stojcev:
  Networks on Chip; Axel Jantsch, Hannu Tenhunen (Eds.). Kluwer Academic Publishers, Boston; 2003. Hardcover, pp 303, plus VIII, ISBN 1-4020-7392-5. 1203-1204
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• Mile K. Stojcev:
  Memory architecture exploration for programmable embedded systems; Peter Grun, Nikil Dutt, Alexandru Nicolau. Kluwer Academic Publishers, Boston. 2003. Hardcover, pp 128, plus XVII, ISBN 1-4020-7324-0. 1205-1206
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Volume 44, Number 8, August 2004

• Rolf-Peter Vollertsen:
  Fast wafer level reliability: methods and experiences. 1207-1208
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• Andreas Martin, Rolf-Peter Vollertsen:
  An introduction to fast wafer level reliability monitoring for integrated circuit mass production. 1209-1231
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• Summer F. C. Tseng, Wei-Ting Kary Chien, Excimer Gong, Willings Wang, Bing-Chu Cai:
  Some practical considerations for effective and efficient wafer-level reliability control. 1233-1243
  Electronic Edition (link) BibTeX
• David Smeets, Josef Fazekas:
  Quantifying charging damage in gate oxides of antenna structures for WLR monitoring. 1245-1250
  Electronic Edition (link) BibTeX
• Werner Muth, Wolfgang Walter:
  Bias temperature instability assessment of n- and p-channel MOS transistors using a polysilicon resistive heated scribe lane test structure. 1251-1262
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• Barry O'Connell, Prasad Chaparala, Bhola Mehrotra:
  Evaluation of performance-reliability trade-offs in a Si-Ge BiCMOS process using fast wafer level techniques. 1263-1268
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• Guoqiao Tao, Andrea Scarpa, Leo van Marwijk, Kitty van Dijk, Fred G. Kuper:
  Applying the fWLR concept to Stress induced leakage current in non-volatile memory processes. 1269-1273
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• Mile K. Stojcev:
  Reliability of Computer Systems and Networks: Fault Tolerance, Analysis and Design; Martin L. Shooman. John Wiley and Sons Inc., New York; 2002. Hardcover, pp 528, plus XXII. 1275-1276
  Electronic Edition (link) BibTeX
• Mile K. Stojcev:
  Power Distribution Networks in High Speed Integrated Circuits; Andrey Mezhiba, Eby Friedman. Kluwer Academic Publishers, Boston; 2004. Hardcover, 280pp, plus XXIII, ISBN 1-4020-7534-0. 1277-1278
  Electronic Edition (link) BibTeX
• Mile K. Stojcev:
  Digital design and computer architecture; Hassan A. Farhat. CRC Press, Boca Raton: 2004. Hardcover, 487pp, plus XXII. ISBN 0-8493-1191-8. 1279-1280
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