X. R. Zhang

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2004

1 EE X. Q. Shi, H. L. J. Pang, X. R. Zhang: Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. Microelectronics Reliability 44(5): 841-852 (2004)

2004
1	EE	X. Q. Shi, H. L. J. Pang, X. R. Zhang: Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. Microelectronics Reliability 44(5): 841-852 (2004)

Coauthor Index

1 H. L. J. Pang [1]

2 X. Q. Shi [1]