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Mike Cibulsky

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2004
1EEDaniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie: Materials characterization of the effect of mechanical bending on area array package interconnects. Microelectronics Reliability 44(2): 275-285 (2004)

Coauthor Index

1Doug Abbott [1]
2N. Todd Castello [1]
3Daniel T. Rooney [1]
4Dongji Xie [1]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)