![]() |
| 2008 | ||
|---|---|---|
| 2 | EE | E. Jung, Dionysios Manessis, A. Neumann, L. Bottcher, T. Braun, J. Bauer, Herbert Reichl, B. Iafelice, F. Destro, R. Gambari: Lamination And Microstructuring Technology for a Bio-Cell Multiwell array CoRR abs/0802.3082: (2008) |
| 2004 | ||
| 1 | EE | Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl: Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Microelectronics Reliability 44(5): 797-803 (2004) |
| 1 | Rolf Aschenbrenner | [1] |
| 2 | J. Bauer | [2] |
| 3 | L. Bottcher | [2] |
| 4 | T. Braun | [2] |
| 5 | F. Destro | [2] |
| 6 | R. Gambari | [2] |
| 7 | B. Iafelice | [2] |
| 8 | E. Jung | [2] |
| 9 | A. Neumann | [2] |
| 10 | Andreas Ostmann | [1] |
| 11 | Rainer Patzelt | [1] |
| 12 | Herbert Reichl | [1] [2] |