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Frode Strisland

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2004
1EEFrøydis Oldervoll, Frode Strisland: Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures. Microelectronics Reliability 44(6): 1009-1015 (2004)

Coauthor Index

1Frøydis Oldervoll [1]

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