Frode Strisland
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2004
1
EE
Frøydis Oldervoll
, Frode Strisland: Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures.
Microelectronics Reliability 44
(6): 1009-1015 (2004)
Coauthor
Index
1
Frøydis Oldervoll
[
1
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Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
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