Ikuo Shohji
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2004
1
EE
Ikuo Shohji,
Hideo Mori
,
Yasumitsu Orii
: Solder joint reliability evaluation of chip scale package using a modified Coffin-Manson equation.
Microelectronics Reliability 44
(2): 269-274 (2004)
Coauthor
Index
1
Hideo Mori
[
1
]
2
Yasumitsu Orii
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
