| |
| 2004 | ||
|---|---|---|
| 1 | EE | Tadanori Shimoto, Katsumi Kikuchi, Kazuhiro Baba, Koji Matsui, Hirokazu Honda, Keiichiro Kata: High-performance FCBGA based on multi-layer thin-substrate packaging technology. Microelectronics Reliability 44(3): 515-520 (2004) |
| 1 | Kazuhiro Baba | [1] |
| 2 | Hirokazu Honda | [1] |
| 3 | Keiichiro Kata | [1] |
| 4 | Koji Matsui | [1] |
| 5 | Tadanori Shimoto | [1] |