Jing Feng Gong
List of publications from the
DBLP Bibliography Server
-
FAQ
Coauthor Index
- Ask others: ACM
DL
/
Guide
-
CiteSeer
-
CSB
-
Google
-
MSN
-
Yahoo
2004
1
EE
Esther Wai Ching Yau
, Jing Feng Gong,
Philip Chan
: Al surface morphology effect on flip-chip solder bump shear strength.
Microelectronics Reliability 44
(2): 323-331 (2004)
Coauthor
Index
1
Philip Chan
[
1
]
2
Esther Wai Ching Yau
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
