| |
| 2005 | ||
|---|---|---|
| 2 | EE | Tadanori Shimoto, Kazuhiro Baba, Koji Matsui, Jun Tsukano, Takehiko Maeda, Kenji Oyachi: Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs. Microelectronics Reliability 45(3-4): 567-574 (2005) |
| 2004 | ||
| 1 | EE | Tadanori Shimoto, Katsumi Kikuchi, Kazuhiro Baba, Koji Matsui, Hirokazu Honda, Keiichiro Kata: High-performance FCBGA based on multi-layer thin-substrate packaging technology. Microelectronics Reliability 44(3): 515-520 (2004) |
| 1 | Hirokazu Honda | [1] |
| 2 | Keiichiro Kata | [1] |
| 3 | Katsumi Kikuchi | [1] |
| 4 | Takehiko Maeda | [2] |
| 5 | Koji Matsui | [1] [2] |
| 6 | Kenji Oyachi | [2] |
| 7 | Tadanori Shimoto | [1] [2] |
| 8 | Jun Tsukano | [2] |