| |
| 2008 | ||
|---|---|---|
| 2 | EE | E. Jung, Andreas Ostmann, Peter Ramm, Jürgen Wolf, Michael Toepper, Maik Wiemer: Through Silicon Vias as Enablers for 3D Systems CoRR abs/0805.0918: (2008) |
| 2004 | ||
| 1 | EE | Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl: Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Microelectronics Reliability 44(5): 797-803 (2004) |
| 1 | Rolf Aschenbrenner | [1] |
| 2 | E. Jung | [2] |
| 3 | Dionysios Manessis | [1] |
| 4 | Rainer Patzelt | [1] |
| 5 | Peter Ramm | [2] |
| 6 | Herbert Reichl | [1] |
| 7 | Michael Toepper | [2] |
| 8 | Maik Wiemer | [2] |
| 9 | Jürgen Wolf | [2] |