| |
| 2004 | ||
|---|---|---|
| 1 | EE | Li Zhang, Vivek Arora, Luu Nguyen, Nikhil Kelkar: Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages. Microelectronics Reliability 44(3): 533-541 (2004) |
| 1 | Vivek Arora | [1] |
| 2 | Nikhil Kelkar | [1] |
| 3 | Li Zhang | [1] |